PUBLICATIONS

Dernière mise à jour : 09/03/2026
  • Torretti, E., Paparoni, F., Cook, J.D., D’Elia, A., Di Cicco, A., Douillard, L., Faure, M., Marcelli, A., Minicucci, M., O’Neill, W., Rollin, E., Sparkes, M., Spataro, B., Lockwood, N., Rezvani, S.J. "Interplay of deposition kinetics with metal diffusion in MoO-Cu heterojunctions" Applied Surface Science., 630: art.n° 162680. (2025).