PUBLICATIONS

Dernière mise à jour : 09/03/2026
  • Chang, Y.W., Cheng, Y., Helfen, L., Xu, F., Tian, T., Scheel, M., Di Michiel, M., Chen, C., Tu, K.N., Baumbach, T. "Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation" Scientific Reports., 7: art.n° 17950. (2017).